kw.\*:("Biphényle(4,4p-diamino-2,2p-diméthyl)")
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Polymerization, structure and thermal properties of ODPA-DMB polyimide filmsKIM, Y. H; MOON, B. S; HARRIS, F. W et al.Journal of thermal analysis. 1996, Vol 46, Num 3-4, pp 921-933, issn 0368-4466Article
